BE Semiconductor Industries N.V.

BESIY · OTC

Market closed$258.33$-9.08 (-3.40%)After hours $258.33 · 0.00%

Key statistics

Previous close$267.41

Open$252.22

Day high$262.30

Day low$250.05

52-week high$374.33

52-week low$122.81

Market cap20.45B

Volume2.13K

Average volume8.94K

P/E ratio116.89

Forward P/E—

EPS2.21

Dividend yield+0.70%

Market context

Why it moved

BE Semiconductor (BESIY) shares declined today likely due to broader semiconductor sector selling pressure and risk-off sentiment in the market, as no specific company-level catalysts were identified to explain the pullback.

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What is happening

Recent company-specific developments and publisher coverage.

Stock Titan · April 23, 2026Hybrid bonding bookings lift Besi orders to €269.7 million Bloomberg.com · April 14, 2026BE Semiconductor Hits Record High as BofA Says Market is Underestimating Demand Seeking Alpha · March 6, 2026Besi plunges after AI chip makers ponder slowdown in hybrid bonding tech: report GlobeNewswire · February 19, 2026BE Semiconductor Industries N.V. Announces Q4-25 and Full Year 2025 Results

Benzinga · April 6, 2026Samsung Vs. SK Hynix: The High-Stakes Race To Perfect 'Hybrid Bonding' For Nvidia's Next AI Chips

Peers

ASML Holding N.V.ASML · $1,747.58-2.09%

ASM International N.V.ASM.AS · €869.40-4.04%

Applied Materials, Inc.AMAT · $529.66-5.57%

Lam Research CorporationLRCX · $313.30-2.39%

KLA CorporationKLAC · $212.75-3.02%

Tokyo Electron Limited8035.T · ¥65,100.00-8.17%

Advantest CorporationADTTF · $174.30-0.71%

Teradyne, Inc.TER · $322.36+0.02%

Kulicke and Soffa Industries, Inc.KLIC · $97.22-1.82%

ASMPT LimitedASMVF · $22.200.00%

Cohu, Inc.COHU · $51.19-0.62%

Onto Innovation Inc.ONTO · $279.85-0.62%

Company profile

BE Semiconductor Industries N.V. (Besi), founded in 1995 and headquartered in Duiven, the Netherlands, is a global leader in the development, manufacturing, and servicing of advanced semiconductor assembly equipment for the semiconductor and electronics industries. The company operates through three core segments — Die Attach, Packaging, and Plating — offering a broad portfolio of solutions including flip-chip and hybrid bonding systems, wafer-level packaging, molding, singulation, and plating equipment under its well-known brands Datacon, Esec, Fico, and Meco. With approximately 1,820 employees and a market capitalization exceeding $29 billion, Besi holds a dominant market position, commanding an estimated 40% share in die attach equipment and approximately 75% in advanced die attach, serving leading multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and electronics companies worldwide. Listed on Euronext Amsterdam under the symbol BESI and traded in the U.S. as an ADR under BESIY, the company has become a critical enabler of next-generation packaging technologies powering AI, automotive, and mobile applications.

Symbol: BESIY
Exchange: OTC
Sector: Technology
Industry: Semiconductors
CEO: Richard W. Blickman
Employees: 1,856
Country: NL
IPO date: 1995-12-05
Website: besi.com

Analyst consensus

hold

0 ratings

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