Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp. (3189.TW) is a Taiwan-based semiconductor materials company incorporated in 2000 and headquartered in Taoyuan City, principally engaged in the manufacture and distribution of IC substrates and printed circuit boards (PCBs) for global semiconductor packaging markets. The company operates through two segments — IC Substrate and Optics — with its core product portfolio encompassing plastic ball grid array (BGA) substrates, flip chip substrates, chip scale package (CSP) substrates, system-in-package (SiP) substrates, and RF module substrates, serving applications ranging from microprocessors and GPUs to application processors and wireless connectivity modules. Kinsus distributes its products to integrated circuit packaging, design, and system companies across Taiwan, Mainland China, the United States, Japan, and Europe, with the IC Substrate segment generating the vast majority of revenues. Led by CEO Scott Chen since July 2021, the company employs approximately 7,200 staff and has a market capitalization of approximately NT$424 billion, positioning it as a key enabler in the advanced semiconductor packaging supply chain amid rising demand from AI, high-performance computing, and consumer electronics applications.